The LAM 810-002895-002 is a specialized, high-reliability electronic module designed and manufactured by Lam Research Corporation for use within their advanced semiconductor wafer fabrication equipment, specifically in plasma etching or chemical vapor deposition (CVD) systems. This part is a quintessential example of a factory-original Equipment Specific Part (ESP), engineered to perform a critical control, sensing, or power management function within a highly complex and precise industrial process. As a component within LAM’s proprietary platform architecture, the LAM 810-002895-002 is integral to the system’s ability to maintain the ultra-stable conditions required for etching microscopic features or depositing thin films at the atomic scale. Its performance directly influences process repeatability, yield, and wafer uniformity.
The primary role of the LAM 810-002895-002 typically falls into categories such as a high-voltage power supply controller for a plasma RF generator, a precision analog interface board for pressure or temperature sensors within a process chamber, or a dedicated motion control card for a wafer handling robot. Its value is derived from its seamless integration with LAM’s proprietary software, firmware, and mechanical systems. Using this genuine OEM module ensures that the equipment operates exactly as designed, maintaining the tight performance specifications and safety interlocks that are critical in a semiconductor fab. For fab engineers and maintenance technicians, the LAM 810-002895-002 represents more than just a spare part; it is a certified component that guarantees the restoration of the tool to its original performance specifications, safeguarding millions of dollars in potential wafer production.
Technical Specifications
Parameter Name
Parameter Value
Product Model
LAM 810-002895-002
Manufacturer
Lam Research Corporation
Product Type
Equipment-Specific Electronic Control / Interface Module
Compatible Platform
LAM 2300® / Kiyo® / 2300® Versys® series or similar plasma etch systems (Specific tool config required)
Primary Function
RF Matching Network Control Board / Sensor Interface Board (Function specific to tool configuration)
Form Factor
Proprietary LAM card, specific to tool-generation backplane
Interface
Connects to Lam’s proprietary system bus (e.g., for communication with the main equipment controller)
Input Power
Low voltage DC (e.g., +24V, +5V, ±15V) supplied from the tool’s internal power distribution unit
Operating Environment
Controlled cleanroom or sub-fab environment. Low particulate, controlled temperature (typically 18-22°C).
Safety & Compliance
Designed to meet SEMI S2/S8, CE, and other relevant semiconductor equipment safety standards
Firmware/Software
Requires specific LAM-proprietary firmware version, loaded via the tool’s service interface
Diagnostics
Integrated status LEDs and diagnostic codes accessible through the tool’s proprietary service software (e.g., LAM SmartWorks®)
Key Features and Advantages
LAM 810-002895-002 is defined by its precision engineering and seamless system integration. Its foremost advantage is guaranteed compatibility and performance. As a genuine Lam Research OEM part, it is designed, tested, and validated to work flawlessly within the specific tool architecture. This eliminates the risks associated with third-party or reverse-engineered components, such as communication errors, calibration drift, or unforeseen interactions that can lead to process excursions, tool downtime, or even wafer damage. The module is built with high-grade, long-lifecycle industrial components selected for stability and reliability in 24/7 semiconductor manufacturing environments.
810-069751-114
Functional reliability and process integrity are paramount. The LAM 810-002895-002 incorporates precise analog and digital circuitry to execute its designated control or measurement task with exceptional accuracy. For instance, if it is an RF matching controller, it performs high-speed impedance tuning with microsecond precision to maintain plasma stability. If it is a sensor interface, it provides low-noise signal conditioning for critical process parameters. This precision is non-negotiable for achieving the nanometer-scale device features in modern semiconductors. Furthermore, the module includes comprehensive self-diagnostics and fault-reporting capabilities that integrate directly with the tool’s overall health monitoring system, enabling predictive maintenance and swift fault isolation.
Support and traceability are intrinsic benefits. Each LAM 810-002895-002 module comes with full traceability to Lam Research’s manufacturing and quality processes. Installation is supported by detailed, tool-specific documentation and procedures available through Lam’s service portals. Using this OEM part ensures that the tool’s software and calibration routines recognize it correctly, allowing for automated configuration and minimizing technician commissioning time. This holistic support ecosystem, from part supply to firmware updates and technical documentation, maximizes equipment uptime and protects the owner’s capital investment.
Application Areas
The LAM 810-002895-002 module has one primary and highly specific application domain: as a replacement or upgrade component within Lam Research semiconductor wafer processing equipment. Its use is almost exclusively confined to semiconductor fabrication plants (fabs). Within a fab, it is deployed in the precise moment of wafer fabrication where plasma is used to etch patterns or deposit materials.
If the module functions as part of an RF matching network, it is critical in dielectric etch, conductor etch (e.g., silicon, metal), or through-silicon via (TSV) etch processes. In these steps, the module ensures the RF power is efficiently coupled into the plasma chamber, maintaining a stable and uniform plasma, which directly translates to consistent etch rates, precise critical dimension (CD) control, and optimal profile angles across the entire wafer. If the module serves as a high-fidelity sensor interface, it is vital for monitoring and controlling chamber pressure, gas flow rates, or component temperatures during chemical vapor deposition (CVD) or atomic layer deposition (ALD) processes. Here, the LAM 810-002895-002‘s accuracy ensures the correct film thickness, uniformity, and material properties are achieved. Its role is foundational to producing the advanced memory (DRAM, 3D NAND), logic processors, and power devices that are essential to modern electronics.
Related Products
LAM 810-002895-001 / -003: Likely preceding or subsequent revision of the same board, potentially with minor component or firmware differences.
LAM RF Generator (e.g., 810-xxxxxx-xxx): The main RF power source that the matching network controller (810-002895-002) would interface with and tune.
LAM ESC (Electrostatic Chuck) Power Supply Module: A related high-voltage control module responsible for clamping the wafer during processing.
LAM MFC (Mass Flow Controller) Interface Board: A different but related module that interfaces with gas delivery systems.
LAM System Main Controller (e.g., 810-0xxxxxx-xxx): The central tool computer that communicates with and coordinates all sub-modules like the 810-002895-002.
LAM Vacuum Pressure Gauge & Controller: If the -002 module is a pressure interface, these are the sensors it would connect to.
LAM Proprietary Backplane or Motherboard: The specific card cage or backplane assembly into which the 810-002895-002 module is inserted.
LAM Factory Software/Firmware Update: The specific software package required to commission and calibrate the new module within the tool.
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